Steel Bond Hard Alloy Application

steel bond hard alloy image
Steel bond hard alloy is a new material developed on the basis of cemented carbide, which uses carbide and nitride as hard phase and steel as bonding phase. Carbide phase endows tungsten carbide with good wear resistance and heat resistance. 

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Steel Bond Hard Alloy

steel bond hard alloy image
Steel bond hard alloy is a kind of hard alloy made from hard phase with hard metal (mainly TiC and WC) and bonded phase with steel. Steel bonded hard alloys have both hardness and wear resistance of carbides and good mechanical properties of steel. Therefore, it is mainly used as a wear-resistant part and a machine component. It is an ideal material for cold extrusion die.

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New Electrochromic Window Glass

new electrochromic window glass image

Electric glass is actually the use of electric field generated electrochemical redox reaction, resulting in changes in the characteristics of light penetration, resulting in color change. The electrochromic glass is generally composed of five layers of films, the layers of which are, in order, a transparent conducting layer, an electrochromic layer, an ion conductor layer, a counter electrode and another transparent conducting layer, respectively.

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Violet Tungsten Oxide Ultrafine Tungsten Powder Reduction Advantages

violet tungsten reduction of ultrafine tungsten powder image

The preparation methods of violet tungsten are hydrogen reduction, reverse hydrogen reduction, and liquid ammonia reduction, and the most commonly used methods are hydrogen reduction and reverse hydrogen reduction. Take the reverse hydrogen reduction as the main method, this paper aims to investigate the advantages of tungsten reduction of ultrafine tungsten powder.

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Comparison of Photocatalytic Properties of Nanometer Tungsten Oxide

nanometer tungsten oxide photocatalysis image

Nanotungsten trioxide is a typical N-type semiconductor functional material with large specific surface area, stable chemical properties, and wide band gap (2.2 ~ 2.8eV), can be said that tungsten trioxide is a natural beauty of photocatalytic material in the near-ultraviolet and visible light region has a strong absorption capacity, and good stability.

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Tantalum Doped Tungsten Oxide Thin Films Electrochromic Properties

tantalum doped tungsten oxide thin films image

Tungsten trioxide is a n type semiconductor material, it is the most widely studied photochromic materials, WO3 has excellent electrochromic properties, however, WOX can be dissolved in proton electrolyte, which limits its application in electrolyte for proton conduction layer in electrochromic devices.

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High Temperature Solid Phase Method Prepare Cesium Tungstate Photocatalyst

cesium tungstate photocatalyst image

Cesium tungstate (Cs2WO4), as a new heat insulation material found in recent years, has been widely used in the field of transparent insulation film. Recently, a team has published reports on the preparation of cesium tungstate with solid-phase method and used in the field of photocatalysis.

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Nanometer Tungsten Trioxide Preparation by Prolysis Method

preparation of nanometer tungsten trioxide by pyrolysis method image

Tungsten trioxide is mainly used for high melting point alloy and cemented carbide, tungsten wire and fire gas sensitive materials, also for the photocatalytic materials.

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Characteristics of Dynamic Magnetic Compaction

dynamic magnetic compaction image
Dynamic magnetic compaction has many advantages, such as high forming density, superior mechanical properties, short forming time and wide application. However, because only radial pressure can be used, it can only be applied to cylindrical symmetric tungsten carbide products. And it still has many problems, for example high energy consumption. Specific characteristics of dynamic magnetic compaction are as follows.

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Dynamic Magnetic Compaction: Technology and Equipment

equipment of dynamic magnetic compaction image
The press compact made of dynamic magnetic compaction has many advantages, such as high forming density, superior mechanical properties, short forming time and wide application. Similar to the common molding process, the equipment is composed of four parts: pulse power supply, electromagnetic field coil winding, material delivery system and programmable logic controller system.

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