Tungsten Carbide Ball High Precision Grinding Methods (2/2)

In this mechanism, except that the corner of the grinding disc groove diameter, V-channel angle and other geometrical parameters, but also with three abrasive disk rotational speed related. Through three platen speed adjustments can change (within the range of values of -90 ° -90 °) the angle of rotation. In addition, ball blank can be done changing the relative orientation of the spin axis of the grinding motion, its grinding trajectory line is he central axis of the shaft space sphere curve. In this way it is possible to cover the entire surface of the ball blank uniformly conducive to ball billet surface to obtain a uniform and efficient grinding. However, while this method in experiments to ensure good processing accuracy and processing efficiency, but in the actual production practice of commissioning and maintenance there are some difficulties to promote the production and use.

The double rotation grinding by the relevant domestic researchers first proposed, which is based on self-active control angle grinding, under the premise of maintaining the corner from the active control function, the upper lapping plate in the process of fixing the circumferential direction, and applied to ball billet certain elastic load, such that the larger ball blank allowance subject to greater loads, which also meet the size of the ball milled selective conditions. In addition, it uses two separate grinding trays rotating components, simplifying the mechanical structure also reduces the difficulty of assembling and processing (grinding process, the grinding tray during the grinding process does not need to rotate, so that the lower plate coaxial low requirements). But this process also has some problems, due to cobalt tungsten carbide ball in the grinding process prone to greater inertia, which will grind the whole trajectory and process have a certain impact, and high hardness of tungsten carbide cobalt will be on the ball trench uneven wear such precision can not be guaranteed.

Eccentric V-slot grinding, its axis of abrasive tray rotation and V-slot has a certain offset distance, which makes the ball billet revolution center and the center of rotation of the tray is not in the same straight line, and the contact point on the ball billet grinding tray along the upper abrasive tray radial direction. Compared with conventional V-slot grinding, it can achieve better spherical deviation. Chinese scholars also puts forward the optimization program, even if the eccentric disk and V-groove grinding discs rotate simultaneously, by adjusting the rotational speed of the upper and lower grinding disc, grinding track is sufficiently divergent, thus weakening offset the adverse effects of polishing uniformity.

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