The present invention provides a method for preparing suitable for ultra-fine crystalline diamond cutting tool coatings. Specific steps are as follows:

a) The cutting tool substrate a deposition reaction chamber;

b) The deposition reaction chamber is evacuated to a vacuum state;

c) Forming a magnetic field in the deposition reaction chamber;

d) Mounted to the cathode deposition reaction chamber, a high current is applied between the anode and the DC arc deposition reaction chamber purged with argon Ar, H2 and methane CH4 three hydrogen gas; wherein the arc current is applied 150A ~ 250A; the ratio of the methane introduced into CH4 / H2 hydrogen gas is 0.5 to 10%; passed into argon Ar flow 2000 ~ 4000sccm;

E) In the deposition chamber, the gas in the arcing CH4 generated carbon radical C, under certain temperature conditions C Radical carbon deposition substrate surface to the cutting tool into the polycrystalline diamond thin film; wherein the deposition reaction chamber temperature of 600 ℃ ~ 1000 ℃; working pressure of 0.9mbar ~ 2mbar; deposition time is 3 ~ 30h.

The present invention, by controlling the deposition temperature of the reaction chamber (600 ℃ ~ 1000 ℃), the working pressure (0.9mbar ~ 2mbar), gas flow rate, deposition time (3 ~ 30h) and other process parameters to control the growth of diamond grains, obtaining about for the 0.3 ~ 1μm fine grain diamond coating, which makes cutting tools coated with better performance of the diamond coating, machining and longer life.


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The present invention provides a method for tungsten chemical vapor deposition apparatus abnormality detection. Specific steps are as follows:

1) Set the accuracy of the scan and the scan signal to noise ratio of tungsten hexafluoride with silane gas prior to the reduction reaction of the wafer to obtain the initial number of fine particles;

2) The tungsten chemical vapor deposition apparatus of silane and tungsten hexafluoride gas reduction reaction of a tungsten film on the wafer surface;

3) Scan the same SNR and a tungsten film formed on the surface accuracy of scanning the wafer number of fine particles obtained after the reaction;

4) Analyzing the number of fine particles after the initial reaction of the fine particles to increase the number of fine particles as compared to the wafer surface is a gas phase nucleation of fine particles of tungsten;

5) If the fine particles are not scanned vapor nucleation of fine particles of tungsten, tungsten chemical vapor deposition apparatus is introduced into the gas control means that no abnormality has occurred;

6) If the scan is fine particles to the gas phase nucleation of fine particles of tungsten, tungsten chemical vapor deposition apparatus is introduced into the gas control means is abnormal.

W can be accurately determined whether a chemical vapor deposition apparatus of the present invention by the method of abnormality, and the process does not affect the continuity.


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Electroless nickel plating of iron-based powder metallurgy products, which is the original plating process of electroless nickel plating process into steps, adding chemicals in electroless nickel plating process, the chemical components of the solution:

NaH2PO2. H2O: 1.5 ~ 3.0%; NiSO4.6H2O: 2.0 ~ 3.5%; NaC2H3O2: 0.2 ~ 0.8%; Na2CO3: 1.0 ~ 2.2%; CH3CHOHCO2H: 2. 0 ~ 3.5%; H2O: 80.0 ~ 95.0%

Process conditions:

1) Preparation of electroless plating solution is first weighed NaH2PO2. Uniformly dissolved and stirred H2O, NaC2H3O2 placed 50 ~ 85 ℃ 200 g Water;

2) was added with stirring and then adding the remainder of the NiSO4.6H2O uniformly dissolved in water;

3) and finally adding Na2CO3 CH3CHOHCO2H, chemical bath was adjusted to PH value 5.0-6.5, filtered through filter paper Serve.

Electroless nickel plating process is the surface roughness after polishing, blasting, cleaning, degreasing, pickling processes activated after iron-based powder metallurgy products, placed in a chemical bath at a temperature of 80 ~ 95 ℃ soak for 20 ~ 60 minutes, then washed, fine polishing, cleaning process after the completion of the iron-based powder metallurgy products coated on amorphous Ni-P alloy layer.


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The present invention provides a silicon laser cladding nickel titanium - tungsten carbide composite coating material preparation methods, and its purpose is to be prepared by laser cladding Ni3 (Si, Ti) intermetallic compounds in the Ni-base superalloy substrate, Ni-based solid solution , ceramic composite coating composition of TiC-coated WC; coating material mainly containing Ni, Si, Ti, and four WC powders, in weight percent: WC 8% to 20%, the balance being Ni78Si13Ti9;

The preparation method of using the laser cladding process parameters:

Output power 1200-1500W, scanning speed 4-8mm / s, spot diameter 4mm, protective cladding when gas is Ar gas, clad base material is a nickel-base superalloy, the steps are: the above ratio, the coating material mixing, thermal spray coating or pre-nickel-based superalloy substrate surface 0.8 ~ 1.0mm; multi-pass scanning laser cladding, each lap 1.8mm, available in different thickness of the cladding layer.


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This invention relates to a carbon-based coating of tungsten, characterized in that: a substrate comprising carbon and tungsten coating of two parts, a dense and uniform coating layer having a thickness of tungsten is firmly attached to the surface of the carbon matrix. Pure tungsten plate as the target. Carbon material as the matrix, Select C / C composites and graphite.

Advantage of the present invention is:

A) depositing a tungsten coating speed, greatly improving the efficiency of the preparation of the coating;

B) high density plasma generated between the tungsten target cloud and carbon, a large number of tungsten atoms only covers the surface of the carbon substrate, the substrate and the back side is attached to the package tungsten coating;

C) coating the surface of a dense, no cracks;

D) coating and C / C composites bonded to the substrate better.


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The invention provides a copper-coated zirconium tungstate promote composite powder pretreatment methods. Specific steps are as follows:

A) Roughening: Weigh ZrW2O8 powder, concentrated nitric acid was stirred magnetically while being heated to about 30 ~ 60min, washing and drying;

B) Activation of sensitization step: the coarse powder after pretreatment per 100ml solution sensitization and activation process 10gZrW2O8 powder, 30 ~ 50min after cleaning and drying sensitization and activation, activation of the preparation per liter sensitizing solution is as follows: 0 .3 g ~ 0.4gPdCl2; 60mlHCl; 30 ~ 40gSnCl2; 140g ~ 160gNaCl;

C) Preparation of the bath: meter per liter, bath composition as follows: the main salt sulfate (CuSO4.5H2O) 15 ~ 42g; reducing formaldehyde (HCHO) 12 ~ 40ml; chelating agent EDTA-2Na44 ~ 66g; stabilizer potassium ferrocyanide 20mg; 2-2 'dipyridyl 20mg; solubility-promoting agent in methanol (CH3OH) 100ml; adjusted with sodium hydroxide (NaOH) to the plating solution to the PH value of 12 to 13;

D) Weigh 2.5 ~ 10g / L of activated with sensitizing ZrW2O8 powder added to the plating solution, sonicated 30 ~ 45min, ZrW2O8 powder surface will be a layer of copper plating.

The present invention provides a method, the process is simple and reasonable, good coating effect, can be used for VLSI and electronic devices on the substrate material.


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The present invention provides a diamond, cubic boron nitride particles coated tungsten, chromium, molybdenum method. Specific steps are as follows:

1) Clean and pollution diamond, cubic boron nitride particles into the heating chamber in a vacuum or protective atmosphere of diamond, cubic boron nitride particles are pre-heated;

2) The heated diamond, cubic boron nitride particles transported to the coating room with a vibration or blender to open as a coating material for metal carbonyl complexes of steam into the steam switch to the coating chamber input metal carbonyl complexes of steam, start vibrating or blender, using a heated diamond, cubic boron nitride brought the heat, so that the metal carbonyl complexes in diamond, cubic boron nitride particle surface decomposition, the diamond, cubic boron nitride particles are evenly coated metal surfaces layer;

3) The complete coating of diamond, cubic boron nitride particles are transported to the cooling chamber passivation passivation cooling the material or heating the coating cycle to the next one, until the desired thickness of the final passivation of the material was cooled and purified packaging.

The present invention provides a method which is capable of uniformly continuous diamond, cubic boron nitride particles embodiment of tungsten, chromium, molybdenum monolayer or multilayer composite coating, the abrasive and the bonding metal carcass reinforcement, extending diamond cubic BN life products.


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The present invention provides a copper mass percentage of 25% to 40% margin for the preparation of tungsten tungsten copper alloy, concrete steps are as follows:

A) the percentage by mass of 5% to 20% copper, copper tungsten alloy and tungsten and having the same mass percent tungsten powder uniformly mixed 8 hours to 16 hours;

B) in the mixture of 180 Mpa ~ 200Mpa molded under pressure to obtain a green compact;

C) The compact is placed in a hydrogen furnace for pre-sintering, the sintering temperature of 900 ~ 1000 ℃, for 0.5 hour to 1 hour to obtain a copper tungsten alloy frame;

D) by measuring the quality of pre-sintered compacts M, calculate the volume porosity V λ = (1-M / V / ρ ↓ [blank]), and then calculate the amount of infiltration of copper = λ × V × ρ ↓ [Cu ], where ρ ↓ [blank] compacts with the same composition as the theoretical density tungsten-copper alloy, ρ ↓ [Cu] is the theoretical density of copper;

Copper infiltration amount (1.1 to 1.2) times the copper 5) will be in step (4) molded into the calculation of the same size with the copper surface of the skeleton;

E) The copper tungsten copper alloy frame is placed above and aligned, into the graphite crucible, alumina landfill, heated to 1350 ~ 1400 ℃ for copper infiltration, i.e., for 1 to 3 hours to give a percentage by mass of copper is 25 % ~ 40%, the balance being copper tungsten, tungsten alloy.

Tungsten copper alloy of the present invention provides a method for preparing a high copper content in the obtained tungsten-copper alloy which has more than 98% of high density, high conductivity, and electrical contacts suitable for electrode materials, electronic packaging materials, high temperature materials, such as sweating .


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The present invention provides a tungsten-based alloy particles and the method of combining a solid iron. Specific steps are:

1) After the iron abrasive blasting to the surface roughness, and then coated with a layer of solder paste copper, tungsten-based alloy particles evenly placed, and then baked in an oven to heat up, the process can be used to heat up the oven to heat up the stage;

2) Heating at 1100 ~ 1250 ℃ to solder copper just completely melted, to be combined with solder copper tungsten alloy particles completely dissolved, and finally after cooling down to room temperature, so that the tungsten particles and iron-based alloys formed seamlessly.

Note: tungsten alloy particles can be used tungsten-silicon alloy particles. Heating in an oven so that the protective gas added during the solder iron and copper is not oxidized.

The method of the invention can tungsten alloy particles with a solid combination of iron, to produce grinding discs and other equipment. Tungsten alloy sharp and hard, can effectively polish the rough surface. With power tools, high efficiency, ordinary sanding disc 100 times life.


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The present invention provides a method of rolling a thin sheet of tungsten, tungsten metal sheet to a processing method, especially a method for the rolling process the X-ray CT machine precision tungsten shielding sheet material used. Specific steps are as follows:

1) First, the blank plate is heated to a tungsten sheet 180 ℃ -220 ℃;

2) The mist sprayed tungsten graphite sheet blank plate incubated for 20-30 minutes and drying;

3) Heated to rolling temperature for rolling.

The present invention provides a sheet processing tungsten good uniform lubricating coating, the lubricating coating to solve the tungsten sheet surface quality and tolerance control of the adverse effects. So that the surface of the graphite sheet milk from tungsten large loss from exposure to the processing rate of about 40% to about 60%, so that the surface roughness can be achieved 1μm ~ 2μm. Dimensional tolerances of ± 0.01mm. Effectively improve the bonding strength of graphite and tungsten film surface can be mass CT machine with ultra-high precision tungsten film.


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