The present invention describes a rare earth - Ni - Mo - P - tungsten alloy plating solution formula to solve the electroless plating - nickel - molybdenum - phosphorus alloy technology exists bath temperature is high, poor stability, chemical deposition rate is low, microhardness small issues;

Formulations of the present invention include nickel chloride / nickel sulfate, sodium hypophosphite, sodium molybdate, rare earth, tungsten carbide, sodium citrate / citric acid, glycolic acid / sodium glycolate, succinic acid, boric acid, sodium hydroxide / sodium carbonate, thiourea, sodium dodecylbenzenesulfonate, a cathode current density Dk is 0.05 ~ 2.5, pH 7.0 to 8.5 at a temperature (T) of 30 ~ 65 ℃, anode nickel plate or platinum electrodes inert electrodes, cathode plating plating.

The temperature of the plating solution of the present invention significantly lower than the electroless plating solution, good stability, the deposition rate increased significantly, and easy to control, the plating solution of the present invention can be widely used in the plating process.
RE - Ni - Mo - P - Tungsten Alloy Plating Solution

The present invention is to introduce a tungsten carbide - steel gradient resistant materials.

Resistant materials can form gradients infiltrated tungsten carbide into steel (WC) by high-energy ions.

Currently on the market of high-chromium steels, cast stone and other wear-resistant surfacing materials present WC short life, the shortcomings of hardness, strength, toughness.

The invention form WC on the carbon or alloy steel surface on discharge principle. WC hardened layer ≥ 0.8mm, which WC rich layer over 0.3mm. WC - steel wear resistant materials gradient performance is usually hardened alloy tool steel 4 to 15 times, and has integrated high performance hard, high strength, high toughness, etc., which meets the technical requirements of many anti-wear conditions.
 

Tungsten chemical on atomic layer deposition method of vapor deposition

The present invention provides a chemical vapor deposition method for atomic layer deposition of tungsten. Specific steps are as follows:

A) Using a first reaction gas chemical vapor deposition process to form a first reaction gas atoms deposited layer;

B) The effect of residual gas finished first reaction gas extraction;

C) A second reaction gas containing tungsten chemical vapor deposition process to form a gas phase to the second atomic layer deposition comprising the first reaction gas tungsten atomic layer deposition reaction;

D) The role of the second reaction gas tungsten finished pumping the remaining gas;

E) Repeat the above step A to D at least one step of forming cycle;

F) In the cycle, the select part of the cycle repeated in step C and D at least once.Tungsten Chemical on Atomic Layer Deposition Method of Vapor Deposition
 

The present invention describes a tungsten / copper graded material. Characterized in that:

1) Material Design: both ends of the W / Cu graded materials are W and Cu alloys, the volume of distribution of the gradient layer W by the formula C = (x / d) p calculated, where: C is the volume of any gradient layer W percentage, x is the position of the layer corresponding to the gradient, d is the thickness of the graded layer, p is the composition distribution index, p values ​​in the range of 0.6-1.8;

2) the thickness of the metal layer W 1-4mm, the thickness of the metal Cu 1-2mm;

3) layers of the intermediate layer is 1-8 layers; in order to improve the bonding strength between the W-Cu, 5-10 weight percent of added copper in the metal binder phase, these adhesives are Ni, Zr, V , Ti and Cr.