Tungsten Copper Electrode Erosion Mechanism III

Tungsten powder re-sintering is can not be neglected when arcing. After Cu evaporating by pulsed arc, some W grains will be exposed in medium. This tungsten grains re-sintering and spheroidizing or transferring to the surface by surface effect at high temperature, which make the cracks expand inside skeleton inevitably. In general, tungsten copper will volatile and compound in high temperature arc, which the cracks is accelerating the erosion.

Those tiny pores left by Cu evaporating will become the source of the next cracks and the re-sintering accelerate cracks expanding. In addition, the oxides combine electrode contact with arc-blast medium and carbide is brittle so that they will be broken and spalling under mechanical impact until the electrode failed.

More infomation about tungsten copper electrode erosion mechanism, click here:

http://news.chinatungsten.com/en/tungsten-information/79477-ti-10142 
http://news.chinatungsten.com/en/tungsten-information/79543-ti-10144

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