Magnetron Sputtering Producing Tungsten Trioxide Films

Sputtering method is a physical vapor deposition method. It is through energetic particle impact a solid so the solid atoms emitted from the surface and deposited onto a substrate or surface film to form films. Sputtering method is divided into DC sputtering, screen shot sputtering, magnetron sputtering, and ion beam sputtering and so on. Wherein the magnetron sputtering method deposition technology is a faster, lower operating pressure sputtering technique, because of its unique features is widely used. Using magnetron sputtering method produces tungsten trioxide film the thickness from tens of nanometers to several hundred nanometers range. Produced by magnetron sputtering of tungsten trioxide films main control several conditions are: first, a tungsten target with a purity of 99.9% by the tungsten powder pressed secondly, the substrate is transparent flat glass (25mm), then the working gas is argon gas (> 99.99%), and reactive gas is oxygen (> 99.99%), where pressure ratio of oxygen and argon is 75%. Finally, set the operating pressure is 1.5 Pa, sputtering current of 0.12 A, the sputtering voltage of 520V, the target distance of 7cm, the sputtering time was 45min. 

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