Activated Recrystallization of Non-Sag Tungsten Wire(1)

Under a low temperature condition, the recrystallization will occur by adding some metals (such as palladium, nickel, iron and others) to the wire surface. It is an important process when the wires act as reinforcement material in metal matrix composites because of its damage to the mechanical properties of non-sag tungsten wires.

Transmission Electron Microscope (TEM) observations about the initial stage of recrystallization of 0.18 mm doped tungsten wire showed that the formation, through dislocation rearrangement, of new grains with a relative disorientation could play a critical role in the recrystallizing process. The impeding effect of potassium bubbles both on dislocation rearrangement and boundary migration resulted in the abnormal recrystallized behavior of the heavily drawn doped tungsten wire. In addition, it was found that the non-<110> orientation of recrystallized tungsten grains could originate either from the grains with a non-<110> orientation in the starting material or from the newly nucleated grains. These observations could explain the recrystallizated features of tungsten wire which the current theory could not account for.

 

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