Technology of Tungsten Copper Heat Sink and Electronic Packaging Materials

Tungsten copper alloy phase composed of tungsten and copper is not uniformly distributed solid solution and compound forming a kind of composite material, high thermal conductivity, both copper and tungsten, high melting point, low thermal expansion properties, electronic industry is preferred heat sink and package material.

Recently, some scholars have proposed a new production method of tungsten copper heat sink material and electronic packaging material, which is different from the commonly used infiltration technology.

1.The purity of more than 99.95%, the average particle size of tungsten powder's 3~8 micron, the purity of more than 99.95%, the average particle size of -300 is to use the electrolytic copper powder;

2.Adding inducer and mixture: the electrolytic copper powder is used as an inducer to be mixed with the tungsten powder in the powder mixing machine.

3.Compression moulding. The mixture is automatically molded according to a predetermined shape, and the tungsten copper green body after the molding is automatically isostatically pressed; The isostatic pressure is complex, the W-Cu green molding automatic molding after the coating material of vacuum package, and then in the isostatic press for static pressure, static pressure vessel is 150 ~ 260MPa; The package material is an aluminum plastic composite film.

4.Pre-sintering: Sintering the pressed tungsten copper green body in a molybdenum wire furnace to obtain a tungsten copper alloy body;

5.Liquid copper impregnation. The copper infiltration furnace is filled with liquid electrolytic copper with the purity of more than or equal to 99.95 percent, immersing the pre-sintered tungsten copper alloy ingot into the liquid electrolytic copper at 1200 to 1400 DEG C for 1 to 2.5 hours. The process is carried out under the protection of a reducing gas or a mixture of a reducing gas and an inert gas, and then the tungsten copper alloy ingot is extracted from the liquid electrolytic copper and cooled to obtain a tungsten-copper alloy.

The improved process effectively solves the defects and shortcomings of traditional technology. The tungsten and copper heat sink and electronic packaging material are evenly and denser, and the performance is improved significantly. At the same time, the production process is reasonable, the production efficiency is high, and the production cost is significantly reduced.

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