Reactive Magnetron Sputtering Method Preparing Nanometer Tungsten Sulfide Membrane
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- Category: Tungsten Information
- Published on Monday, 30 October 2017 22:41
Tungsten sulfide is an excellent solid lubricant material, it has high application value in the field of super solid lubrication, especially its role in the aerospace industry.
Tungsten sulfide thin membrane have layered structure, it has lower hardness and better stability under high temperature, it is suitable to be used as a solid lubricant for friction parts in special environment. There are three main methods for preparing tungsten disulfide membrane which include RF sputtering method, reactive magnetron sputtering method, chemical deposition method.
Reactive magnetron sputtering method is used to bombard pure tungsten targets with high energy noble gas and hydrogen sulfide mixed gas ions, the sputtered atoms react with the sulfur ions released from hydrogen sulfide gas to form a thin membrane on the substrate, reactive magnetron sputtering is also one of the most commonly used methods to obtain WS2 thin membranes.
Preparation of WS2 thin membranes on quartz substrates by reactive magnetron sputtering. A tungsten target with a purity of 99.95% was used, the substrate is 10 cm away from the target, the background vacuum is 4 x 10-4 Pa, fill in argon, the working pressure is 1 ~ 6Pa, sputtering power is 100W, the WS2 membrane with base orientation can be obtained by this method.
The operaion of reactive magnetron sputtering is that when the low-energy ions collide with the target surface, the atoms can not be sputtered directly from the solid surface, instead, the momentum is transferred to the colliding atoms, causing chain induced collisions of atoms on lattice lattices, the collision will follow all directions of the crystal lattice, at the same time, collisions are most effective in the direction of the closest arrangement of atoms, as a result, the atoms on the surface of the crystal get more and more energy from the nearest atom, if this energy is greater than the binding energy of the atom, the atoms will be sputtered out, the compound particles are formed by reacting with the active gas ions added to the inert working gas to form a compound film which is different from the target composition.
The target materials used in reactive magnetron sputtering, such as single element targets or multi-element targets and reactive gases, can obtain high purity, therefore, it is beneficial to prepare high purity compound membrane.
Reactive magnetron sputtering is suitable for the preparation of large area homogeneous membrane and can achieve the industrial production of coating million square meters per year.
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