Gold Plating Recovery Solution
- Details
- Category: Tungsten Information
- Published on Wednesday, 23 October 2013 09:10
Dissolving Materials
Use chemicals to dissolve the materials underneath the gold of circuit boards. CBX and StripFree products work well but do have drawbacks. CBX is a powder that is good to use in areas where not a lot of other metal types are close. It will be used too quickly otherwise, reducing its cost effectiveness. StripFree should be used when an item is stainless steel based, as the solution uses an electric current to separate the gold from the board. It does require access to a car battery to work, however.
Acid Baths
Use an acid bath. While the chemicals above dissolve the materials beneath gold, acid baths are designed to dissolve the gold itself. Aqua Regia is an acid used to submerge the circuit boards. Once the boards are removed from the acid, the remaining brown, murky water will contain dissolved particles of gold. This process uses highly corrosive substances that have been made safer by the inclusion of SubZero as a replacement for nitric acid in traditional Aqua Regia. Protective clothing and precautions should still be taken when using an acid bath process.
Precipitant
Use a precipitant. Added to water, the precipitant will form a solution that will separate the gold from the acid. The separated gold, once the acid has been discarded, will resemble brown mud. At this point, no further chemicals or solutions will be needed to retrieve the gold. Washing the mud in aqua ammonia and tap water will result in a powder. The powder will then need to be melted to return the gold to its pure state.
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