Preparation of Tungsten Copper Heat Sink Materials and Electronic Packaging Materials

The present invention provides a process for the preparation of tungsten-copper heat sink materials and electronic packaging materials. Specific steps are as follows:

1) Powder is ready to take purity ≥99.95%, the average fee's 3-8 micron particle size of tungsten powder, take purity ≥99.95%, an average particle size of 300 mesh copper powder stand;

2) Add the induction agent and mixing the copper powder as an inducer of the tungsten powder mixed in a powder blender;

3) Compression moulding, including the mix and mold in predetermined shape, and mold tungsten copper green automatically performed after forming isostatic overburden pressure treatment;

4) Pre-pressing sintering step 3 after forming tungsten copper green pre-sintered molybdenum wire furnace to obtain tungsten copper alloy body;

5) Liquid copper infiltration ≥99.95% purity liquid containing copper in copper stove in infiltration, tungsten copper alloy pre-sintered body was immersed in the liquid copper 1200 ℃ ~ 1400 ℃ copper immersion in liquid-penetration for 1 to 2.5 hours, the process under a protective gas or reducing gas mixture of reducing gas and an inert gas for, and after the copper alloy of tungsten copper raised from the liquid body, then cooled to obtain tungsten copper alloy.

Note: in Step 2, the electrolytic copper powder added in an amount of 0% to 6% of the tungsten-copper alloy of the total weight, into the amount of electrolytic copper powder as described in step 2 and step 5, add the amount of copper in the liquid and accounted for 15 to 25 percent of the total weight of tungsten-copper alloy.


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