RE - Ni - Mo - P - RE - Ni - Mo - P - Tungsten Alloy Plating Solution

The present invention describes a rare earth - Ni - Mo - P - tungsten alloy plating solution formula to solve the electroless plating - nickel - molybdenum - phosphorus alloy technology exists bath temperature is high, poor stability, chemical deposition rate is low, microhardness small issues;

Formulations of the present invention include nickel chloride / nickel sulfate, sodium hypophosphite, sodium molybdate, rare earth, tungsten carbide, sodium citrate / citric acid, glycolic acid / sodium glycolate, succinic acid, boric acid, sodium hydroxide / sodium carbonate, thiourea, sodium dodecylbenzenesulfonate, a cathode current density Dk is 0.05 ~ 2.5, pH 7.0 to 8.5 at a temperature (T) of 30 ~ 65 ℃, anode nickel plate or platinum electrodes inert electrodes, cathode plating plating.

The temperature of the plating solution of the present invention significantly lower than the electroless plating solution, good stability, the deposition rate increased significantly, and easy to control, the plating solution of the present invention can be widely used in the plating process.
RE - Ni - Mo - P - Tungsten Alloy Plating Solution

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