Predominately hexagonal GaN nucleation layers were grown on sapphire substrate by low pressure metal-organic vapor phase epitaxy. Tilt angles of GaN single crystallites about the normal of sapphire substrate are determined to be in the range from 0° to 5° by using selected area electron diffraction. A small portion of cubic phase of GaN was observed to be selectively distributed in the grain boundary areas and the instantaneous surface state is suggested to play an important role in the nucleation of the Zincblende phase. Phase transition from hexagonal to cubic GaN caused by heavy radiation from ion beam was also noticed. A critical temperature is proposed to exist in forming predominately cubic or hexagonal GaN nucleation layer.

We studied the effects of the growth rate of a GaN buffer layer grown on a GaN epilayer. It was found that this growth rate plays a key role in improving the quality of the GaN film on a sapphire substrate and an optimum growth rate exists that yields the best crystal quality. A GaN film grown on a buffer layer with the optimum growth rate of 18.3 nm/min has an electron Hall mobility of 539 cm²/V s and a dislocation density of approximately 2×108 cm^-2. These improvements of GaN film qualities are illustrated by the promotion of the lateral growth mode.


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Predominately hexagonal GaN nucleation layers were grown on sapphire substrate by low pressure metal-organic vapor phase epitaxy. Tilt angles of GaN single crystallites about the normal of sapphire substrate are determined to be in the range from 0° to 5° by using selected area electron diffraction. A small portion of cubic phase of GaN was observed to be selectively distributed in the grain boundary areas and the instantaneous surface state is suggested to play an important role in the nucleation of the Zincblende phase. Phase transition from hexagonal to cubic GaN caused by heavy radiation from ion beam was also noticed. A critical temperature is proposed to exist in forming predominately cubic or hexagonal GaN nucleation layer.

Epitaxially laterally overgrown GaN on sapphire was used to reduce the number of threading dislocations originating from the interface of the GaN epilayer with the sapphire substrate. The GaN layer above the SiO2 mask area surrounding the window, corresponding to the lateral overgrowth, was nearly free of the threading dislocations. A high density of threading dislocations was observed in the vicinity of GaN grown in the window regions. InGaN multi-quantum-well-structure laser diodes (LDs) grown on pure GaN substrates, which were fabricated by removing the sapphire substrate, were demonstrated. The LDs with an output power of 5 mW exhibited a lifetime of more than 290 h and an estimated lifetime of 10,000 h despite a relatively large threshold current density. The far-field pattern of the LDs with a cleaved mirror facet revealed single-mode emission without any interference effects.


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Semipolar GaN was achieved by controlling anisotropic growth rates in a maskless r-plane patterned sapphire substrate. Upon optimizing the growth conditions, the growth rate of the GaN layer on etched c-plane-like sapphire was much higher than that on other planes such as the original r-plane sapphire. Singularly-oriented GaN was confirmed when GaN was grown on only the c-plane-like sapphire sidewall. The control of the anisotropic growth rate is useful for growing nonpolar and semipolar layers using maskless patterned substrates.

In this letter we describe the structuralcharacteristics of nonpolar a-plane GaNthin filmsgrown on r-plane sapphire substrates via metalorganic chemical vapor deposition. Planar growth surfaces have been achieved and the potential for device-quality layers realized by depositing a low temperature nucleation layer prior to high temperature epitaxialgrowth. The in-plane orientation of the GaN with respect to the -plane sapphire substrate was confirmed to be and This relationship is explicitly defined since the polarity of the -GaN films was determined using convergent beam electron diffraction. Threading dislocations and stacking faults, observed in plan-view and cross-sectional transmission electron microscope images, dominated the -GaN microstructure with densities of and respectively. Submicron pits and crystallographic terraces were observed on the optically specular -GaN surface with atomic force microscopy.


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A nitride-based high-power flip-chip (FC) light-emitting diode (LED) with a double-side patterned sapphire substrate (PSS) was proposed and realized. Under 350-mA current injection, it was found that forward voltages were 3.24, 3.26, and 3.25 V for the conventional FC LED, FC LED prepared on PSS, and FC LED with double-side PSS, respectively. It was found that the 350-mA LED output powers were 79.3, 98.1, and 121.5 mW for the conventional FC LED, FC LED prepared on PSS, and FC LED with double-side PSS, respectively. In other words, we can enhance the electroluminescence intensity by 53% without increasing operation voltage of the fabricated LED.

An InGaN–GaN light-emitting diode (LED) with a roughened undoped-GaN surface and a silver mirror on the sapphire substrate was fabricated through a double transfer method. It was found that, at an injection current of 20 mA, its luminance intensity was 100% larger than conventional LEDs. Its output power was 49% larger than conventional LEDs.


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