A technique for separating a thick AlN layer grown by hydride vapor phase epitaxy (HVPE) on a sapphire substrate was developed. By heat treatment at 1450 ℃ in a gas flow containing H2 and NH3, many voids could be formed at the interface between a thin (100 nm) AlN layer grown at 1065 ℃ and the sapphire substrate due to the preferential decomposition of sapphire. During the cooling process after the subsequent growth of a thick (85 μm) AlN layer, the thick AlN layer separated from the sapphire substrate with the aid of the interfacial voids. The freestanding AlN substrate thus obtained had a smooth surface, a dislocation density of 1.1× 109 cm-2, and an optical transparency for wavelengths above 208.1 nm.

Single‐crystal layers of AlN have been grown on sapphire substrates between 1000 and 1100 °C by vapor‐phase reaction of aluminum chlorides with ammonia. The purity, color, crystallinity, growth morphology, and electrical resistivity of the epitaxial layers have been investigated. Infrared specular reflection measurements showed the presence of an appreciable strain at the AlN‐sapphire epitaxy interface. Optical absorption data strongly suggest the AlN is a direct band‐gap material with a value of about 6.2 eV at room temperature.


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We report the measurement of carrier concentration and mobility of metalorganic chemical vapor deposited GaN thin films on the sapphire substrate by an infrared reflection technique. By fitting with the experimental data we obtain all the parameters of the lattice vibration oscillators and of the plasmon. From the plasmon frequency and the damping constant we have derived the carrier concentration and the electron mobility. The concentration agrees with the Hall data very well while the mobility values are smaller than that of the Hall measurement by a factor of about 0.5. We attribute such mobility lowering to the increase of scattering for the electrons coupling with the incident photons.

GaN layers are grown on sapphire substrate by electron cyclotron resonance molecular beam epitaxy (ECR-MBE) using an ECR plasma cell with ion removal magnets on the cell top for the nitrogen source. The efficiency of the ion removal magnets in this ECR plasma cell is 99%. High-quality GaN layers are obtained. In particular, (2×2) and (4×4) RHEED (reflection high-energy electron diffraction) patterns are observed during GaN growth and during cooling after growth, respectively, indicating a flat and smooth surface of GaN. These results show the superiority of the ion-removed ECR plasma cell.


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GaN-based light-emitting diodes (LEDs) with emitting wavelength of 450 nm were grown on patterned sapphire substrates (PSSs) fabricated by chemical wet etching. The crystallography-etched facet was R-plane with a 57deg against C-axis and had superior capability for enhancing light extraction efficiency. The light output power of the PSS LED was 1.15 times higher than that of the conventional LED at an injection current of 20 mA. The output power and external quantum efficiency were estimated to be 9 mW and 16.4%, respectively. The improvement was attributed not only to geometrical shapes of {1-102} crystallography-etched facets that efficiently scatter the guided light to find escape cones, but also to dislocation density reduction by adopting the PSS growth scheme.

Lattice constants of gallium nitride (wurzite structure) have been measured at temperatures 294–753 K. The measurements were performed by using x‐ray diffractometry. Two kinds of samples were used: (1) bulk monocrystal grown at pressure of 15 kbar, (2) epitaxial layer grown on a sapphire substrate. The latter had a smaller lattice constant in a direction parallel to the interface plane by about 0.03%. This difference was induced by a higher thermal expansion of the sapphire with respect to the GaN layer. However, this thermal strain was created mainly at temperatures below 500–600 K. Above these temperatures the lattice mismatch in parallel direction diminished to zero at a temperature of about 800 K.


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The temperature of encapsulated green and ultraviolet light emitting diodes (LEDs) in operation has been measured optically via the ruby R lines emitted by the residual Cr3+ contaminations in the sapphire substrate. These two photoluminescent R lines, which are excited by the electroluminescence of the LED itself, show a well-characterized line shift as a function of temperature and pressure. The temperature is found to rise linearly with the applied forward current of the LED at a rate of ≈1 K/mA. This optical temperature measurement based on monitoring the two ruby R lines could qualify as a sensitive method for an in situ temperature sensor for other sapphire substrate based semiconductor devices such as laser diodes and field effect transistors.

Indium–gallium nitride (InxGa1-xN) single-quantum-well (SQW) light emitting diodes (LEDs), grown by metalorganic chemical vapor deposition on sapphire, were transferred onto Si substrates. The thin-film InxGa1-xN SQW LED structures were first bonded onto a n+-Si substrate using a transient-liquid-phase Pd–In wafer-bonding process followed by a laser lift-off technique to remove the sapphire growth substrate. Individual, 250×250 μm2, LEDs with a backside contact through the n+-Si substrate were then fabricated. The LEDs had a typical turn-on voltage of 2.5 V and a forward current of 100 mA at 5.4 V. The room-temperature emission peak for the InxGa1-xN SQW LEDs was centered at 455 nm with a full width at half maximum of 19 nm.


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