Nickel Plating Method for Tungsten-copper Composite Material

A method of nickel-plated tungsten-copper composite material, characterized by: comprising the following steps: (1) degreasing: Remove the tungsten-copper composite material surface oil; (2) etching: the tungsten-copper composite material is placed in the moment etching solution at room temperature etching l_5min, tungsten copper composite oxide film covering the surface of red-brown, wash; (3) activation: the step (2) etched tungsten-copper composite material is placed in hydrochloric acid at room temperature _40 ° C activation 2-5min, wash; (4) pre-nickel: the step (3) activation of tungsten-copper composite material was placed in a pre-nickel plating bath nickel pre-plated, conditions: room temperature _40 ° C, cathode current density of 4 ~ 8A / dm2, anode using purity of 99.99% of the electrolytic nickel plate, nickel time 2-5min, the coating having a thickness of 0.3 ~ 0.5 μ m; wash; (5) nickel: the step (4 ) nickel pre-plated tungsten-copper composite material was placed in a nickel plating solution and nickel plating, conditions: at 40 ~ 60 ° C, the cathode plate to wavy as the cathode and a sulfur-containing nickel plate as the anode, the first order of 0.20 to 0.5 current density electrolysis 10-15h A / dm2, the electrodeposited color recess wavy bright cathode plate, then add a pH of 3-4.5 of 30 ~ 40g / L of boric acid solution to I ~ 3A / dm2 of current density electrolysis 2-4min, the coating having a thickness of 0.5 ~ I μ m, wash; (6) Heat treatment: the step (5) W-Cu composite material was placed in a nickel-plated chain furnace, mixing in hydrogen and nitrogen atmosphere, 780-810 ° C treatment 0.5-2h; (7) degreasing: removal step (6) tungsten-copper composite material surface dirt after heat treatment; (8) Activation: The tungsten after degreasing step (7) copper composite material is placed in hydrochloric acid at room temperature _40 ° C activation 2-5min, Wash; (9) pre-plated nickel: the step (3) after activation tungsten-copper composite material is placed in a pre-pre-nickel plating nickel plating solution , conditions: room temperature _40 ° C, cathode current density of 4 ~ 8A / dm2, anode using purity of 99.99% of electrolytic nickel plate, nickel time 2-5min, the coating having a thickness of 0.3 ~ 0.5 μ m; wash; (10) Nickel Plating: The step (4) nickel pre-plated tungsten-copper composite material was placed in a nickel plating solution and nickel plating, conditions: at 40 ~ 60 ° C, the wave-shaped cathode plate to the cathode, In sulfur-containing nickel plate as the anode, first to 0.20 ~ 0.5A / dm2 current density electrolysis 10-15h, electrodeposited color recess wavy bright cathode plate, then add a pH of 3-4.5 of 30 ~ 40g / L boric acid solution to the current density electrolysis 10-25min I ~ 3A / dm2, and the coating thickness is 2 ~ 5.5 μ m, washing, drying, too.

copper-tungsten-material


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