Tungsten Copper Heat Sink

Tungsten copper heat sink is a part of electronic packaging technology, because of the low expansion property of tungsten and thermal conductivity of copper is higher, the use of tungsten copper coefficient of thermal expansion and conductive thermal conductivity of materials to facilitate the use of materials.

Tungsten copper heat sink convenience for optoelectronic devices and cooling electronics convenience, on the one hand, in a light emitting diode and a high power laser, the physical design of the tungsten copper electronic package is convenient for cooling the peripheral fluid (the surface area of the air contact is increased); On the other hand, in the graphics processor and the computer central processor, the heat sink plays an important role in the final junction of the thermal interface material and the basic attachment method. The heat dissipation performance of heat sink can be determined by test attribute value.

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