Tungsten Copper Sintered Properties (2/2)

Electric Conductivity Test: It is a relative simple process that put tungsten copper (W-Cu) sintered body with high surface roughness grinded by metallographic abrasive paper on the equipment, and generally use alternating current bridge method, first determine the resistivity of the formula, and then through the relationship between conductivity and resistivity calculate the conductivity, but also during the relative conductivity values were calculated (based on the relative value of conductivity international standard soft copper is annealed conductivity of copper is 100% 1.7241μΩ • cm conductivity).

Shrinkage Test: It is essential that Measure the diameter and thickness of the blank with a caliper, sintered tungsten copper will be erased and the surface of the sintered powder with a caliper at this time of the diameter and thickness were measured again. According to the formula to calculate the radial shrinkage of the shrinkage of the sintered body (S_D = (D-D_S) / D × 100%, D is the diameter of the green body, D_S is the diameter of a sintered body, S_D is a radial shrinkage of the sintered body).

SEM: (Scanning electron microscope) SEM adapts a focused electron beam on the surface of tungsten copper samples at a predetermined time and space sequence gate intensive scanning secondary electron interaction with the sample signal transmission, the transmission must change after two photoelectric conversion by point presentation on the microscopic screen, whereby the reaction of the sample surface topography secondary electron image. In addition, the sample of SEM can be block or powder, but it should be noticed that vacuum can ensure the stability. For magnetic sample should be demagnetized in advance in case that the electron beam was observed to prevent being affected by magnetic fields.

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