Contact Resistance of Tungsten Probe

Contact resistance of tungsten probe will affect the reliability of wafer testing in semiconductor manufacturing processes. Therefore, in order to improve the accuracy of test results, some experts have proposed a method for testing the contact resistance of tungsten probe.

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A Method for Detecting Tungsten Probe Contact Resistance

Provide the wafer to be inspected, the pad is formed on the wafer, the pad is connected to the power supply VDD; the tungsten needle is in contact with the pad, and the power supply VDD is grounded; power supply provides multiple measurement currents to the probe to obtain the corresponding measurement voltage on the probe; calculate the resistance value R of the contact resistance of the probe according to the measurement current and the measurement voltage. The actual contact resistance between the probe and the pad can be obtained through simple steps using the structure of the wafer itself. This will help yield analysis and improve the accuracy of wafer probing.

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