WCu composites are made by infiltrating, under vacuum, uniform controlled porous blocks of tungsten with molten co pper. This results in a material with an interconnected copper matrix that has high thermal conductivity in all axis, low thermal expansion, and good electrical conductivity, Copper content can range between 10% and 25%.

 

Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.