2×100×100mm tungsten copper plate with thickness of 2mm and width and length of 100mm can be widely used in high temperature resistant materials, electrical alloys for high voltage switch, electromachining electrodes and microelectronic materials. It is widely used as components and components. Aerospace, aviation, electronics, power, metallurgy, machinery, sports equipment and other industries.

Compared with common Blank plate, it has better performance in roughness and surface quality. And common copper electrode has large consumption, low precision and efficiency when processing tungsten carbide, high carbon steel, hardened tool steel, while tungsten copper has greatly improved the efficiency and accuracy. Tungsten copper not only has good electrical conductivity, high soften temperature, wear and corrosion resistance, long service life and low frequency of electrode correction, but also save the production costs based on improving efficiency.

Tungsten copper blank plate is composed of high purity tungsten powder and copper powder, by isostatic pressing, high temperature sintering, melting refined copper infiltration process.

W90 tungsten copper plate is composed of 90% W and 10% Cu, its density is up to 16.75g/cm3, hardness reaches more than HB260, the bending strength is 1160MPa, the conductivity is 27%IACS and the softening temperature is more than 900℃.

W85 tungsten copper plate is composed of 85% W and 15% Cu, its density reaches(15.90g/cm3), hardness more than HB240, electric conductivity is 38%IACS, softening temperature is ≥900℃, thermal conductivity coefficient is between 180-200 (wm/k) and the coefficient of expansion is 7.0-7.5 (10-6k).

W80 tungsten copper plate is composed of 80% W and 20% Cu so that high hardness and melting point characteristics of tungsten is more obvious. Its density is up to 15.15g/cm3, hardness reaches more than HB140, but due to less Cu, conductivity is decreasing to 34%IACS, softening temperature is ≥900℃,the bending strength is 980, the thermal conductivity is 190-210(wm/k) and the coefficient of expansion is 8.0-8.5(10-6K).

W75 tungsten copper plate is composed of 75% W and 25% Cu, which not only has high density (14.50g/cm3), high hardness (≥HB195), high strength, but also has good conductivity (%38IACS), softening temperature is ≥900℃, thermal conductivity coefficient is between 200-230 (wm/k) and the coefficient of expansion is 9.0-9.5 (10-6k).

W70 tungsten copper plate is composed of 70% W and 30% Cu so that it is harder than W50 and W60 rods. Its density is up to 12.75g/cm3, hardness reaches more than HB140, and conductivity is 47%IACS, softening temperature is ≥900℃ and the bending strength is 790.

W65 tungsten copper plate has many advantages, such as excellent electrical and thermal conductivity, uniform texture, high density, high-temperature resistance and arc erosion resistance, which can be widely used in high-temperature materials, high-voltage switch with electrical alloy, EDM electrodes, and microelectronic materials.

W60 tungsten copper plate is composed of 60% W and 40% Cu, which not only has high density (12.75g/cm3), high hardness (≥HB140), high strength, but also has good conductivity (%47IACS), softening temperature is ≥900℃.