What is Tungsten Copper Plate

Tungsten copper plate properties: it has good plasticity and high electrical conductivity, its electrical processing speed is relatively fast and easy to machining.

The production：

The technological process of tungsten copper plate is mainly formed by mixing powder, pressing, sintering and infiltration. Make tungsten copper powder press forming before liquid phase sintering. The material prepared by the mixed powder is far inferior to the activated sintering, mechanical alloying and oxide reduction. In order to improve the densification of tungsten copper alloy, it should through nano powder to improve the sintering activity. However, the sintering of nickel will make the electrical and thermal conductivity decrease rapidly make tungsten copper is difficult to produce.

Use of tungsten copper plate: Tungsten copper plate is usually used in electrode material, electric shock material, welding material and guide material. As electrode material, it is widely used in thin electrode discharge machining and high hardness materials; As welding materials are used in radio resistance and submerged arc welding machine; In order to play a guiding role in the protection of various wire rolling.

• < Prev
• Next >