With the improvement of the integration of semiconductor integrated circuits, the size of the device has been reduced. At present, the mainstream semiconductor transistors have reached the size of 22 nanometers or smaller. In order to measure the electrical characteristics of a single small size device, the diameter of the tungsten metal probe needed to contact the device is small enough.

In the process of hydrometallurgy of tungsten, due to the depletion of wolframite resources, hydrometallurgy of tungsten will also turn to scheelite and artificial scheelite as the main raw materials. The production of tungstic acid from Scheelite (powder) and artificial scheelite pulp is one of the key processes. It is also an important process for further processing of deep processed products with tungsten as the main component.

Tungsten zirconium alloy is a typical energy containing structure material, which is fairly stable at room temperature and has high strength, and the zirconium based elements in the tungsten zirconium alloy are induced by impact and release a large amount of heat under impact loading. The tungsten zirconium alloy fragments made of this characteristic can use its strength to penetrate through the target and produce additional damage to the target by its release characteristics. Finally, it can significantly improve the damage effect of the fragment to the target, and has a broad application prospect in the military field.

In order to protect the earth's ozone layer, a zero ODP value of HFCs and HFOs has been introduced in the world, and chlorofluorocarbons (CFCs) and hydrogen chlorofluorocarbons (HCFCs) are eliminated with a zero ODP value. HFCs and HFOs have been widely used as refrigerants, cleaning agents, foaming agents, inextinguishing agents and etching agents.