Tungsten disulfide is a typical sandwich layered structure. Because of its relatively weak van der Waals force between layers, it can also be peeled into single or few layers of nanosheets. Tungsten disulfide is considered as another important two-dimensional nanosheet material besides graphene, which has unique physical, chemical and electrical properties.

Tungsten copper W90 rod is composed of 90% W and 10% Cu, its density is up to 16.75g/cm3, hardness reaches more than HB260, the bending strength is 1160MPa, the conductivity is 27%IACS and the softening temperature is more than 900℃.

Tungsten copper blank rod is composed of high purity tungsten powder and copper powder, by isostatic pressing, high temperature sintering, melting refined copper infiltration process.

Tungsten copper W85 rod is composed of 85% W and 15% Cu, its density reaches(15.90g/cm3), hardness more than HB240, electric conductivity is 38%IACS, softening temperature is ≥900℃, thermal conductivity coefficient is between 180-200 (wm/k) and the coefficient of expansion is 7.0-7.5 (10-6k).