W80 tungsten copper plate is composed of 80% W and 20% Cu so that high hardness and melting point characteristics of tungsten is more obvious. Its density is up to 15.15g/cm3, hardness reaches more than HB140, but due to less Cu, conductivity is decreasing to 34%IACS, softening temperature is ≥900℃,the bending strength is 980, the thermal conductivity is 190-210(wm/k) and the coefficient of expansion is 8.0-8.5(10-6K).

W70 tungsten copper plate is composed of 70% W and 30% Cu so that it is harder than W50 and W60 rods. Its density is up to 12.75g/cm3, hardness reaches more than HB140, and conductivity is 47%IACS, softening temperature is ≥900℃ and the bending strength is 790.

W75 tungsten copper plate is composed of 75% W and 25% Cu, which not only has high density (14.50g/cm3), high hardness (≥HB195), high strength, but also has good conductivity (%38IACS), softening temperature is ≥900℃, thermal conductivity coefficient is between 200-230 (wm/k) and the coefficient of expansion is 9.0-9.5 (10-6k).

W65 tungsten copper plate has many advantages, such as excellent electrical and thermal conductivity, uniform texture, high density, high-temperature resistance and arc erosion resistance, which can be widely used in high-temperature materials, high-voltage switch with electrical alloy, EDM electrodes, and microelectronic materials.