Advanced Sappire Single-Wafer Surface Machining

Less sapphire removal is required to eliminate wire saw damage and to achieve good wafer geometry, enabling us to start with sapphire blanks that are up to 20% thinner. This results in more wafers per boule and reduces kerf loss. Based on current sapphire costs, this could result in a 20% savings for 4" and a 12% savings for 6" processes.

Wafer yields are much greater since there is never more than one wafer at risk at any time. Improved wafer geometry and better TTV result in more uniform EPI layers and increased die yield, which should result in higher quality, more consistent die -- generating more revenue per wafer for both sapphire substrate and LED manufacturers.


Tungsten Manufacturer & Supplier: Chinatungsten Online - http://www.chinatungsten.com
Tel.: 86 592 5129696; Fax: 86 592 5129797
Email: sales@chinatungsten.com
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Molybdenum News & Molybdenum Price: http://news.molybdenum.com.cn

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