China On-Board Chip and Tungsten Sputtering Target Material

With the rapid development of IT, chip can be regarded as the brain of statistics analyses, the core. As for the high-purity sputtering target material, the most high-end application is the field of very large-scale integration circuit chip, that is, semiconductor chip field. It has taken up a large part of market share. 

Moreover, the market absorption capacity will improve with the continuous increase of terminal consumption area (ex. Automobile) demand for semiconductor chips. The on-board chip in China is never simple-minded. In the future, it won’t lack its core.

Today, I am going to tell you some information about sputtering alloy target and sputtering technology.

on board chip picture

One of the raw materials of on-board chip in China is tungsten. To be more specific, it is high-purity sputtering alloy target of which the purity reaches 99.999%.

So, what is the sputtering alloy target?

Tungsten sputtering target material is the key material of the production of electronic film and the bombardment target during the process of sputtering. The tungsten sputtering target can be divided into pure tungsten sputtering target material, tungsten alloy sputtering target material and tungsten trioxide according to chemical composition. The production chain of high-purity tungsten sputtering target material includes the purification of tungsten, the production of target material, the sputtering coating and so on. Among those processes, the production of target material and the sputtering coating are important parts of the whole production chain.

Therefore, it is necessary to know what the sputtering technology is.

The sputtering technology is one of the main technologies applied to the production of electronic film and is one of the physical vapor deposition technologies. 

The principle of sputtering: the sputtering is the process whereby particles are ejected from the tungsten target material due to bombardment of the target by gas ions under high pressure. Then, the ejected tungsten material is deposited on the target board in the form of thin film. The high temperature and vacuum environment inside the process chamber can make the tungsten atoms form tungsten grains. Through the lithography patterning and etching, layers of metal wires are formed in the end. The data transmission of the on-board semiconductor chip is realized by these metal wires.
China has been the world's largest electronics manufacturing and import country since the 1990s. However, at present, only Huawei, Tsinghua Unigroup and Cambrian can develop and produce some simple chips, and other important core chips are almost dependent on imports. How can we prove that we do not lack chips?

tungsten sputtering target material picture

China has been the world's largest electronics manufacturing and import country since the 1990s. However, at present, only Huawei, Tsinghua Unigroup and Cambrian can develop and produce some simple chips, and other important core chips are almost dependent on imports. How can we prove that we do not lack chips?

Letting “Made in China” go to the world is never a pipe dream. Huawei, Tsinghua Unigroup, ZTE, Alibaba and other high-tech enterprises are expected to realize the great ideal of replacing the imported chips with domestically-made chips. Some readers may wonder if there are any evidences to prove that “Made in China” is not a pipe dream? Here come a lot of evidences. We can list the examples of Huawei, Tsinghua Unigroup, ZTE and Alibaba to illustrate this point more vividly.

chip picture

Firstly, we can take Huawei as an example. At present, Huawei headquartered in Shenzhen is the world's largest communications R & D and manufacturing enterprise and invests billions of dollars in the core technology in a year. In addition, Huawei is a competitive high-tech enterprise in the world because its products are basically self-developed. Huawei has been regarded as a strong competitor by a lot of foreign countries.
Secondly, as for Tsinghua Unigroup, it is 51% owned by Tsinghua Holdings and 49% owned by Beijing Jiankun Investment Group; this latter group is controlled by Zhao Weiguo who is also chairman and CEO of Tsinghua Unigroup. At present, Tsinghua Unigroup is China's largest integrated circuit enterprise, the world's third largest mobile phone chip company. It ranks first in China and second in the world in enterprise IT service segment. Global leading IT enterprises such as Intel, HP and Western Digital form strategic cooperation with Tsinghua Unigroup.It has a rapid progress in the domestic chip development and research. For example, it successfully developed the first 32-layer 3D NAND flash memory chips and owns full intellectual property rights. Besides, Tsinghua Unigroup has invested 100 billion to establish a research and development base for the memory chip. The domestic memory chips are expected to replace more than 90% of imported chips in the future. 
Thirdly, ZTE has been working on the development of chips. ZTE is the fourth in the world and the second largest electronic communication company in China. In this year, U.S. has imposed a seven-year export ban on ZTE, forbidding American companies from selling parts and providing services to it. In response, it is said that a few months ago, the company’s executives were committed to vigorously develop its own core chips so that the history of previous ZTE event won’t happen again. 
Speaking of chip research and development, we should also mention Alibaba. Alibaba Group Holding Limited is a multinational e-commerce, retail, Internet, AI and technology conglomerate founded in 1999. Ma Yun is the chairman of the Alibaba board. Alibaba has invested 100 billion a year to set up the Academy for Discovery, Adventure, Momentum and Outlook (Alibaba DAMO Academy) which collects a lot of world-class experts of chip research and development in order to quickly create our own high-tech chips.

semiconductor chip picture

Semiconductor is not only the core of electronic products but also the footstone of the information industry. Therefore, the rise of China's science and technology is inseparable from the development of semiconductor chips. “We still need to work on traditional “MADE IN CHINA”, but the core of “Made in China 2025” is Chinese equipment.”, Prime Minister said at Ministry of Industry and Information Technology Symposium. Letting “Made in China” go into the world is never a pipe dream. Developing our own semiconductor is imperative for our country. The semiconductor chip is one of the Chinese equipment for China’s road of being a science and technology power.

 

 

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