Treatment Technology for Improving Coating Layer Bonding Strength of Tungsten Alloy

The invention relates to a treatment technology for improving the coating layer bonding strength of a tungsten alloy, and mainly solves the problem of reduction of corrosion resistance caused by low bonding strength and easiness in coating layer falling in the tungsten alloy coating layer technology in the prior art.

An electroplating layer is formed by secondary electroplating. The treatment technology comprises the following steps of: performing pretreatment on the tungsten alloy, performing treatment by hydrofluoric acid, electroplating a layer of nickel with the thickness of about 1 micrometer, cleaning and drying, performing high-temperature heating in a sintering furnace full of protective gas, preserving heat for a period of time, cooling, then performing activation pretreatment, electroplating nickel or other metal again outside the electroplating layer until the required total thickness is achieved, then cleaning and drying. By using a twice electroplating mode, metal molecules of a preplated layer and the tungsten alloy can be quickly dispersed by high-temperature heating, so that the bonding strength between the electroplating layer and the tungsten alloy is improved; the secondary electroplating can enable the bonding strength between the electroplating layer and the tungsten alloy to be improved; and the brightness attractiveness and the corrosion resistance of the electroplating layer are kept.


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