Tungstate red phosphor white LED is a new type of solid-state lighting electric light source (SSL). Its principle and structure are different from those of previous vacuum electric light sources such as incandescent lamp and fluorescent lamp. SSL light source has many advantages, especially high light efficiency, energy saving, long life and pollution-free. It has great application value and prospects.

SCR catalyst belongs to hazardous solid waste, which will seriously pollute the environment. Meanwhile, various valuable metals contained in the failed catalyst have not been recycled, resulting in a huge waste of resources. Therefore, the recycling of failed catalysts can not only solve the corresponding risk of environmental pollution, but also turn waste into treasure and make full use of resources.

The new preparation process of tungsten carbide-titanium carbide solid solution tungsten carbide-titanium carbide solid solution is a kind of compound carbide with high melting point, high hardness, high wear resistance, excellent anti-adhesion, oxidation resistance and wear resistance. It is widely used in cemented carbide products for mechanical processing. It is found that when carbide mixtures are added, it is difficult to control the carbon content because of the solid solution reaction during the sintering process. Therefore, carbide solid solution is usually added to cemented carbides in the production of cemented carbides.

Titanium-tungsten alloy has been widely used in microelectronics and biomedicine because of their excellent properties. The alloys formed by adding W to Ti have higher strength and hardness, and the ductility loss is very small. The non-magnetic W solid solution in Ti matrix can reduce the elastic modulus of Ti and increase its radiation resistance. In the field of electronic information, with the development of semiconductor VLSI industry, the elastic modulus of Ti can be reduced. With the development of titanium-tungsten alloy, high purity titanium-tungsten alloys can be used in electrode materials, diffusion barrier layers and wiring materials in the form of thin films.