Tungsten Copper FGM Flexural Strength and Thermal Conductivity

Tungsten copper FGM flexural strength refers to the capability of resistance to external force. Generally, it uses three-point bending test or four-point test method for evaluation. Mechanical properties: The performance of the material by external force; Stress: The reaction material inside to external force. The magnitude of the stress by the following equation: stress (δ) = Effect (F) / unit area of material (A), in units of Pa;Strain: The deformation of material caused by external force. Strain magnitude represented by the following equation: strain (ε) = length change (△L) / initial length (L);Tensile stress, compressive stress, shearing stress.

The flexural strength of W-Cu gradient composites with different layers as the pressure-receiving surface on different surfaces is the flexural strength of different surface. Three-layer and four-layer structure of the gradient composite material to use W-50Cu for the bearing surface, the flexural strength obtained higher than that with W-20Cu as the pressure bearing surface, which shows that the mechanical properties of FGM show a gradient change along the direction of Cu content increasing. In addition, four-layer structure of the gradient material has higher interface bonding strength and smaller residual stress so the resistance to destruction is much better.

Tungsten copper FGM thermal conductivity normally refers to the vertical temperature gradient down 1 ℃ / m, the heat through unit horizontal cross-sectional area per unit time, which is the important measure of FGM material and generally expressed by λ or K.Tungsten copper FGM thermal affected by the pressure barely, and the main influencing factors include one is the density, the lower the density, the higher porosity, the thermal conductivity decreases; other is Cu forms ideal net structure in W matrix, which can provide good heat dissipation channel for the material and remarkably improve the thermal conductivity of tungsten copper composite material. y densification and microstructure analysis of tungsten copper FGM, it can be found that the densities of the three-layer and four-layer structure graded materials have reached a high level (198W / (m • K), 202W / (m • K) ), Are between the package layer and thermal layer thermal conductivity between the access to higher thermal conductivity.The study of tungsten copper FGM thermal conductivity provides solid theoretical foundation for new thermal conductivity of materials and new insulation materials and research, which also gives a strong theoretical and material support for space exploration activities and marine exploration activities in the future. Due to high thermal conductivity and excellent mechanical properties, it can perfectly solve the heat dissipation of electronics next few years.

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