LED Tungsten Copper Heat Base and Other Materials Comparison

Most of LED products, usually you need more than one LED assembled on a circuit board. The circuit board not only needs to carry LED module structure, but also plays an important role in heat dissipation. LED heat dissipation board consists of two major components, one is the system board, and the other is LED grain substrate. Most of the system board is made of metal, which takes advantages of excellent heat dissipation characteristics of its own to achieve the effect. However, with the increasing brightness and efficacy requirements of LED, the bottleneck will appear on the LED grain substrate. In order to break the bottleneck of heat dissipation, researchers around the world look for and develop the substrate materials with high thermal coefficient. Currently, several common LED heat dissipation substrates comprises rigid printed circuit boards, high thermal conductivity aluminum plate, a ceramic substrate, soft printed circuit boards, metal composite materials.

Tungsten copper board for heat dissipation is currently recognized as the most performance fit a class of materials. It has many advantages, such as high strength, low coefficient of thermal expansion, high heat transfer coefficient and so on. By adjusting the component can make up a single hot metal chips and LED mismatch insufficient, so it has been widely used in some large scale integrated circuits, high-power devices, as the radiating element. In addition, electrolytic polishing tungsten copper foil surface finishing can effectively improve the heat dissipation of tungsten copper LED substrate surface flatness to meet the stringent requirements for heat dissipation board of flatness. Thick film ceramic substrate fabricated by screen printing technology and with a spatula printed material on the substrate, after drying, sintering, laser and other processes. But with the decreasing size and lines of LED, higher requirements for precision, the accuracy of such board has been unable to reach. Low-temperature co-sintered multi-layer ceramic substrate printed on the board by screen printing and then integrating the multilayer ceramic substrate, and finally through the low-temperature sintering. But it is supposed to consider the shrinkage ratio after multi-layer ceramic sintering, which is difficult to be controlled.

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