The Special Micro-structure of Tungsten Copper Electrode by Microwave Infiltration

Microwave Infiltration is a new process that combines microwave sintering and infiltration process. Compared with the microstructure of conventional sintering process infiltrated tungsten copper alloy electrodes can find significant differences. For tungsten copper alloy electrode samples of the same composition, at the same sintering parameters using microwave infiltrated samples can be found in a large number of rod-shaped tungsten grain elongated and showed the existence of, and the kind of tungsten rod having a directional grain growth trend. The tungsten grains infiltration under conventional sintering process is more loose and uneven distribution, mostly near-spherical and ovoid, in the organization not only has a large tungsten grain size, there are a lot of smaller grain size tungsten grains, but these tungsten grains merger does not occur at the same time there is no directional trend growth.

Analyzing the experimental data and scanning electron microscope picture, we can find that rod-like tungsten (W) grain is obvious when copper (Cu) content is relatively low. And with the increasing of copper content, tungsten grains are merging and growing, which the directional growth trend is more obvious. In addition, the orientation of the tungsten particle growth law is not certain rules to follow, there is a radial, like rivers, swirling and so irregular shape, which has become some new research directions of scholars and researchers.

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