Chemical Etchant of Tungsten Contacts Material

1. The chemical etchant of tungsten contacts, tungsten copper contacts, silver tungsten contacts, tungsten, nickel and copper contacts, silver-nickel contacts and others is: 50ml of ammonia or 10-30ml of hydrogen peroxide solution (30%). Highlights of use: wipe the surface of the contact material with a freshly prepared solution over 10 seconds.

2. The chemical etchant of tungsten, tungsten carbide or nickel granule in silver tungsten contacts, silver tungsten carbide contacts, copper tungsten contacts, silver-nickel contacts is: potassium ferricyanide mixture, in which,
A. K₃[Fe(CN)₆]     10g         water     90ml
B. NaOH(KOH)    10g         water     90ml
Highlights of use: A and B are mixed and wipe over the surface of the contact material.

3. The chemical etchant of tungsten granule in silver tungsten contacts and copper tungsten contacts is: potassium ferricyanide mixture, hydrochloric acid solution, in which,
A. K₃[Fe(CN)₆]     30g    Water 70ml
B. NaOH(KOH)    10g    Water 90ml
Highlights of use: A and B are mixed and wipe over the surface of the contact material.

4. The chemical etchant of pure copper, copper alloy is: ferric chloride, hydrochloric acid solution, in which,
Ferric chloride                    5g
Hydrochloric acid (concentrated)     50ml
Water                           50ml
Highlights of use: wipe method.

5. The chemical etchant of pure silver, copper graphite is: ferric chloride solution, in which,
Ferric chloride                    10g
Water                           50ml
Highlights of use: wipe method.



 

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