Infiltration Temperature Effect on Tungsten Copper Electrode Properties III

However, with the increasing infiltration temperature, tungsten skeleton sinter in solid phase, which blocks up the rearrangement of particle during the infiltration of copper liquid. The increasing close pores decrease the density of tungsten copper electrode. When the temperature exceeds the limit, tungsten particles will have sintering aggregation. Meanwhile, in the process of infiltration, the surface tension of liquid copper was plummeting copper liquid by capillary force is reduced, resulting in copper liquid overflow.

The hardness of tungsten copper W-25Cu at different infiltration temperature:

The graph shows that the hardness trend is similar to the density trend of tungsten copper W-25Cu, which increases with the increasing temperature at the beginning, and decreases when the temperature exceeds the limit. Due to the hardness of tungsten-copper alloy essentially depends on the density of tungsten copper alloy, for tungsten copper infiltration, before reaching the best temperature, the density of tungsten copper electrode will increase.

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