Sintering Process Effect on Tungsten Copper Electrode Properties IV

When the temperature rises from 1150 ℃ to 1250 ℃, tungsten skeleton density from the 12.15g / cm3 increased to 12.39g / cm3. However, after that sintering temperature continues to rise, in the third stage and post-sintered tungsten skeleton, the density change is small. At this moment, the majority of the pores are completely separated, closed cell number is greatly increased, and pore shape tends to be spherical and shrinking, is not conducive to the process of post-infiltration.

From the aspects of sintering kinetics, the sintered tungsten copper alloy electrodes tungsten powder mainly diffusion and flow of two different mechanisms. Especially in the media and high temperature sintering, surface diffusion becomes very obvious. At this time due to the fine-grained powder, which powder is larger than the surface area of the active surface of the large number of atoms, the diffusion surface it is relatively easy to carry out, which also makes sintered tungsten skeleton easily enter the third stage from the second stage.

More information about sintering process effect on tungsten copper electrode properties, click here:

http://news.chinatungsten.com/en/tungsten-information/80415-ti-10319
http://news.chinatungsten.com/en/tungsten-information/80416-ti-10320

 

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