With the continuous improvement of the power of electronic devices and the miniaturization of devices, the corresponding power density is also increasing, and the problem of heat dissipation is becoming more and more prominent, which puts forward higher requirements for the performance and reliability of heat sink materials.

Traditional cemented carbide is composed of hard WC phase and low melting point metal bonding phase. WC has high hardness, excellent oxidation resistance and corrosion resistance. The addition of metal bonding agent will inevitably weaken the hardness, wear resistance, oxidation resistance and corrosion resistance of the alloy. In addition, it is likely to make the alloy more stable. The decrease of wear resistance, especially the softening and oxidation of metal bond at high temperature, will make WC cemented carbide prone to over-rapid failure, which limits the application scope of WC cemented carbide.

With the rapid development of global industrial technology, environmental pollution has become increasingly serious, which has caused immeasurable harm to people's health and life. Therefore, photocatalytic technology has developed rapidly in recent years. Semiconductor catalysts have attracted extensive attention of scientists for their advantages of simple preparation, low energy consumption and fast degradation.

Tungsten oxide is a very good catalyst and high temperature superconducting material. It is also used to make electrochromic windows, infrared switches, writing, reading and polishing optical equipment, gas sensitive, humidity sensitive and temperature sensitive components. Meanwhile, tungsten oxide nanowires have excellent field emission properties and can be used as structural precursors for WS₂ nanotubes.