Tungsten probe for semiconductor testing may be an alloy probe made of rhenium tungsten alloy, or a tungsten probe made of pure tungsten. Wherein, the contact resistance of rhenium tungsten alloy is slightly higher than tungsten. But their fatigue resistance is similar. In addition, the lattice structure of rhenium tungsten alloy is tighter than tungsten, so the top surface of the rhenium tungsten probe is smoother.

Tungsten needle can be used as a wafer probe. Wherein, tungsten probe is used as a tool for IC (integrated circuit) wafer probing on the circuit board of the probe card, or on the prober, mainly to test the electrical performance of each die on the wafer to see whether they are manufactured in accordance with the designed specifications.

How to recycle tungsten wafer probe? You know, in order to reduce the cost of wafer probing, recycling of tungsten probe is very important. According to the experts, during testing, the tapered tungsten needle began to wear after multiple tests, resulting in a larger diameter of needle tip. At this time, if you do not replace the probing card (one of the tools for wafer testing) containing tungsten needle, it will affect the accuracy of the test results; and if it is replaced, it will increase the cost. In this regard, some researchers have proposed a method for recycling tungsten wafer probe on a probe card.

Tungsten needle is an important part of a wafer probe card, so it is also known as tungsten probe in such a probe card. According to the experts, a probe card, as a main tool for wafer testing, is usually composed of a test circuit board and a conical tungsten needle bent at 95-105 degrees on the circuit board. During the test, the tip of the tungsten probe is directly contacted with the pad of the wafer to be tested, thereby realizing the electrical performance test of the dies of wafer.