LED Engineering Exhibition 2014:Predictable Package into The Era of Large-Scale

With the LED application market demand are rising downstream pull , LED midstream package good day finally came last year , product demand continues to rise, many companies Fun Fun also accelerated the pace of expansion .

"The current pattern of the whole package is still in the stages of change market , strong downstream market demand continued expansion of domestic packaging manufacturers , packaging companies decisive factor in the future competition will be the management , cost control and the size and brand . " participated in last year's LED Lighting Fair 2013 Engineering Taiwan shares GONG Wen Jing , general manager of the view that although the current LED packaging industry trend is clearly the bigger , but the overall market structure variables are still compete for the next two years between the LED packaging companies war will be more intense.

Engineering LED Industry Institute (GLII) statistics show that in 2013 China's packaging industry reached 47.3 billion yuan , an increase of 19 % compared with 39.7 billion yuan in 2012 .

Where last year 's leading packaging companies in the upstream and downstream enterprises took the lead stand up , contrarian growth , in addition to benefiting from rising demand for downstream applications market growth, packaging companies to increase their capacity to release , especially to increase the research and production of non- white device power lighting did not .

Major packaged device manufacturers responsible people have told reporters that this year's orders and a steady increase compared to last year , in which the power devices and downstream COB light source lighting manufacturers gradually being accepted and recognized .

Engineering LED Lighting Fair 2013 exhibitors - Hubei Peter Pang Cheng Electronics Co., Ltd. Deputy General Manager learn that the future will be more and more applications COB , COB products in terms of power will become increasingly high, and light efficiency and cost areas will do better.

In recent years , domestic packaging manufacturers make full use of their localization and price advantage, through the gradual introduction lighting supply chain , improve product quality while gradually seize market share of imported components.

The upcoming September 26, 2014 -28, first moved to Canton Fair Pazhou Pavilion exhibition staged in 2014 Engineering LED packaging companies will continue to work as well as front-line leader in all market segments packaging business representatives , focusing on the promotion of emerging markets this year, the package includes COB, flip flip and trends , such as the market mainstream products .

In the same time, the rapid development of the industry , packaging manufacturers rely on technology and scale advantages are gradually squeezing the living space of a small factory , packaging industry reshuffle , the integration is deepening among .

Liu Yusheng that the next package will accelerate the industry reshuffle , capacity dominant companies will occupy more and more market share.


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