Characteristics for Vacuum Plating with Tungsten Heater
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- Category: Tungsten Information
- Published on Monday, 18 July 2016 13:51
Vacuum plating is a PVD (physical vapor deposition) phenomenon. Injecting the argon gas under a vacuum condition, argon impact target, the target is separated into molecule and to be absorbed by the conductive goods and forming uniformly smooth surface layer. It includes vacuum deposition, sputtering and ion plating and other types. They are processing based on a vacuum condition to deposit various metals and non-metallic thin film on distillation or plastic surface by sputtering, distillation, etc., thin surface coating film can be formed in such method, it also has other outstanding advantages such as fast speed and good adhesion. However, the price is higher, there is less metal type can be operated, so it is generally used for functional coatings of more high-end products, such as an internal shield.
There are two common plastic products plating process: water vacuum ion plating and electroplating. Ion plating is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a version of vacuum deposition. Vacuum plating approach is now a more popular approach, which can make a strong sense of metal products with high brightness. And compared with other coating methods, it needs lower cost and less pollution to the environment, which is now widely used in various industries.
This method uses a tungsten heater has the following characteristics:
1. The metal film obtained by vacuum deposition is thin (typically between 0.01 ~ 0.1μm), and it is possible to copy the shape of injection mold parts surface strictly.
2. Operating voltage is relatively low (200V), which is easy to be operated, but the price of the device is relatively high.
3. Pot bottles volume is small, and production efficiency is low.
4. The melting point of coating piece should be lower than tungsten metal (such as aluminum, silver, copper, gold, etc.).
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