Tungsten Copper Composite Used in Microelectronics

With the rapid development of the chip technology of integrated circuit, microelectronics packaging field has been required further, which has the developing trend towards small, thin, low cost and lead-fee. And with the integrated scale of microelectronic integrated circuit expanding gradually, the power per unit area and heat of integrated circuit increases correspondly, which is also the main challenge microelectronic packing material confronted with. At present, microelectronic packaging materials include three types: PMC (Polymer-matrix Composites), MMC (Metal-matrix Composites), CCC (Carbon-carbon Composites). And the metal-based electronic packaging material is the key directions of research and development. Furthermore, add high-performance ceramics with low coefficient of thermal expansion or other additives into metal matrix can further improve the comprehensive properties of metal-based microelectronic packaging materials.

Tungsten copper heat sink or called as microelectronic packaging material is a kind of metal-based composite material. It can be well matched with silicon, gallium arsenide and other semiconductor material and ceramic materials in microelectronic devices by adapting the proportion of ingredients of W and Cu to achieve reasonable expanding coefficient. And it can also avoid the thermal fatigue damage caused by thermal stress. At the same time, the better performance in electrical and thermal conductivity and excellent microwave shielding function can be obtained. In addition, tungsten copper as a kind of efficient radiating heat sink sweating material, when the temperature exceeds the melting point of copper, due to the melting point of W much higher than Cu, Cu liquefied even evaporated remove the most of heat, which keeps the related equipment working steadily. Therefore, tungsten copper composite material has been widely used in LSI (Large Scale Integrated Circuit) and high-power microwave devices in recent years, such as microprocessors, microwave components, radio communication devices and RF power devices and other high-tech products, it remarkably improve the using power of microelectronic devices and promote them miniaturization.

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