Tungsten Copper Contacts Prepared by Injection Molding

Tungsten copper alloy having a high density, high strength, high temperature resistance, microstructure uniformity, resistance to arc erosion and other characteristics, and its electrical conductivity and thermal conductivity are good. It is widely used, mainly in microelectronics materials, EDM electrode, military high temperature resistance materials, high-voltage switch with electrical alloys, as parts and components are widely used in aerospace, power electronics, machinery, metallurgy, sports equipment and other industries.

Tungsten copper contacts combined with excellent characteristics of the metal tungsten and copper. Among them, tungsten owns high melting point, high density; copper owns superior conductive and thermal performance.
The melting point of tungsten: 3410 ℃; the melting point of copper: 1080 ℃;
Tungsten density: 19.34g / cm3; copper density: 8.89 g / cm3;
Tungsten copper alloy composition range: WCu7 ~ WCu50.

Injection molding is relatively common method of making tungsten copper alloy. Tungsten copper contacts prepared by injection molding method: mixing copper tungsten powder with uniform particle size of 1-5 microns and nickel powder or iron powder with tungsten powder with a particle size of 0.5-2 micron and tungsten powder with a particle size of 5 -15 microns, and then entering into the 25% -30% of the organic bonding agents (such as paraffin or polymethylmethaerylate) for injection molding, then using steam cleaning and irradiation method to remove the binder, sintering in hydrogen, finally to obtain tungsten copper alloy with high density.

 

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