Surface Copper Plating on Tungsten Powder and Its Action

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Category: Tungsten Information
Published on Monday, 23 October 2017 21:01
Tungsten has a high melting point, high density, high hardness, saturated vapor pressure, low coefficient of thermal expansion and other characteristics.
 
rocket launcher image
 
Copper has high thermal conductivity properties, tungsten copper alloy combination is made known to all the materials in aerospace and military fields. The traditional preparation of tungsten copper alloy mainly adopts the method of mechanical mixing, forming and sintering of tungsten powder and copper powder, or using infiltration process. The method is relatively simple, but there are some defects, because of the great difference between tungsten and copper, tungsten and copper can only form pseudo alloy shape, and it is difficult to achieve uniform distribution of tungsten and copper in the interior, resulting in lower or unstable properties. 
 
With the development of Aeronautics and Astronautics and military industry, the demand for tungsten copper exothermic sweating material is higher and higher, Chinese scholars created a powder plating method in electroless copper plating on the surface of tungsten powder can improve the processability, thermal properties of tungsten and tungsten powder or powder metallurgy and other materials forming performance, application scope of the expansion of tungsten powder.
 
Usually chemical plating process: filtered tungsten powder → ultrasonic dispersion and degreasing → activation → multiple washing → plating → drying.
 
1.In order to reduce agglomeration in the process of preparation and storage, tungsten powder was dispersed in 10 min under ultrasonic wave in OP-10 aqueous solution.
 
2.After tungsten powder cleaning, and then through the coarsening, sensitization, activation treatment, adding to the pH value of 12-13 bath, the solution by the copper sulfate, formaldehyde, potassium tartrate, 2, 2-bipyridyl to make.
 
3.Copper began to adjust the mechanical stirring speed so that tungsten powder suspended in the bath, so that the tungsten powder and bath full contact to achieve uniform and stable tungsten powder coating. The temperature of electroless copper plating is kept at about 45 degrees by constant temperature water bath heating bath.
 
4.After spraying for one hour after the tungsten powder becomes red, and in a certain mixing speed tungsten powder has been in the middle of the liquid layer of the solvent. After plating 3 h after the basic colorless bath, and tungsten powder completely red.
 
5.Drying, copper plating process completed.
 
The biggest advantage of copper plating on tungsten powder surface is to improve the uniformity of powder, which makes the performance and stability of the final copper tungsten alloy greatly improved, and provides better conditions for the wide application of tungsten copper composite material.
 

 

 

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