Polymer tungsten is a soft radiation shielding material made of tungsten powder and high molecular polymer (one or more of plastic, rubber or thermoplastic elastomer) through extrusion molding, injection molding or compression molding process. And polymer tungsten radiation protection material can play a good role in blocking X-rays, gamma rays and other radiation rays, so it has been used to produce protective clothing and other medical protective products.

Polymer tungsten is a new lead-free material for production of medical radiation shielding product. According to the experts, the polymer tungsten is also called tungsten resin or tungsten rubber, and is an excellent new radiation protection material to replace traditional toxic lead and lead alloy shielding materials. This new tungsten resin radiation shielding material has a good shielding effect on X-rays and gamma ray, so that it can protect medical personnel.

Radiation resistant polymer tungsten, as the name implies, is a protective material. And it is a new type of protective material. Such a new radiation shielding material has advantages of strong radiation resistance, high density, strong plasticity, easy processing, corrosion resistance, environmental protection, and durability. And it is non-toxic, soft and waterproofing. So, polymer tungsten is considered to be an excellent material for production of medical radiation protection products such as radiation protection clothing, radiation protection skirts, radiation protection caps, and radiation protection surgical gloves.

Polymer tungsten surgical glove is a new type of surgical glove made using natural rubber emulsion and tungsten powder as raw materials through special processing technology. Wherein, polymer tungsten is also known as tungsten resin or tungsten rubber. Such gloves have merits, such as excellent radiation shielding performance, toughness, bendability, and solvent resistance.

Tungsten needle applied for spray point has better performance than traditional steel wire or stainless steel wire. For example, such an electrostatic discharge needle has higher melting point, higher hardness, and longer service life, etc. It also has the characteristics of good ion release effect, and long ion transmission distance. In addition, the tip of needle is not easy to get dull, and is easy to clean.

Sharpen tungsten needle is made using pure tungsten (W> 99.95%) or tungsten alloy (W>98%) as raw materials, and has the characteristics of wear resistance, corrosion resistance and high temperature resistance. It can be a tungsten needle sharpened at one end or a tungsten needle sharpened at both ends. In a word, it is a sharpened tungsten needle.

Contact resistance of tungsten probe will affect the reliability of wafer testing in semiconductor manufacturing processes. Therefore, in order to improve the accuracy of test results, some experts have proposed a method for testing the contact resistance of tungsten probe.

Tungsten probe for semiconductor testing may be an alloy probe made of rhenium tungsten alloy, or a tungsten probe made of pure tungsten. Wherein, the contact resistance of rhenium tungsten alloy is slightly higher than tungsten. But their fatigue resistance is similar. In addition, the lattice structure of rhenium tungsten alloy is tighter than tungsten, so the top surface of the rhenium tungsten probe is smoother.

How to recycle tungsten wafer probe? You know, in order to reduce the cost of wafer probing, recycling of tungsten probe is very important. According to the experts, during testing, the tapered tungsten needle began to wear after multiple tests, resulting in a larger diameter of needle tip. At this time, if you do not replace the probing card (one of the tools for wafer testing) containing tungsten needle, it will affect the accuracy of the test results; and if it is replaced, it will increase the cost. In this regard, some researchers have proposed a method for recycling tungsten wafer probe on a probe card.

Tungsten needle can be used as a wafer probe. Wherein, tungsten probe is used as a tool for IC (integrated circuit) wafer probing on the circuit board of the probe card, or on the prober, mainly to test the electrical performance of each die on the wafer to see whether they are manufactured in accordance with the designed specifications.