Effect of Tungsten Powder Granularity on Hardness and Conductivity (2/2)

There are also many influencing factors of the electrical conductivity of tungsten copper electrode, such as such as impurities, chemical composition, porosity, and some microscopic structure (including the organizational structure of grain size, W-W connectivity, combined with the strength of grain boundaries, high thermal conductivity copper continuity distribution phase) and so on. Tungsten powder particle size largely affected the tungsten copper alloy electrode porosity and microstructure, thus further affecting its conductivity.

On the one hand, tungsten copper is difficult to be completely densified so that some bores emerge unavoidably, which either alone or connected to each other will have a significant impact on the electrical conductivity of tungsten copper alloy. On the other hand, the finer the grain size of tungsten powder crystal, the situation in the suppression of the process more prone to uneven, making sintered tungsten skeleton channels prone to clogging or closed, resulting in copper Cu-rich region from defects in materials or voids, thereby so that copper was infiltrated feeding inadequate or not effectively reduce the integrity of the network structure after copper infiltration, and ultimately reduce the conductivity. With the increase of the particle size of the tungsten powder, tungsten copper alloy grain size distribution is relatively more uniform, closed pores appear relatively reduced, copper Cu and better connectivity, and the electrical conductivity will gradually rise.

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