In the semiconductor industry, the target assembly is composed of a target which meets the sputtering performance and a backplane which can be combined with the target and has a certain strength. The backplane can play a supporting role in assembling the target assembly to the sputtering base, and has the effect of conducting heat. For example, tungsten metal can be selected as target material, copper or copper alloy material with sufficient strength and high thermal conductivity can be selected as backplane to form target component.

According to experts, in the near future, tungsten oxide electrochromic glass can easily achieve warm winter and cool summer! It is said that this is a black technology achievement! Just press the power switch lightly to make the glass "discolor" instantly, from transparent to dark blue. Ordinary glass does not have thermal insulation, and this black technology can make the glass block most of the sunlight in the hot summer, reduce the indoor temperature, thus reducing air conditioning costs and saving energy. Some experts also said that this kind of glass has a certain thermal insulation effect. Moreover, unlike other materials, it only consumes power during the state transition.

Large-scale integrated circuits often use tungsten target for vacuum sputtering, especially large-size tungsten target. In the current semiconductor field, large-size tungsten target has a diameter of 300 mm-450 mm and a thickness of 6 mm-15 mm. However, with the development of semiconductor industry, tungsten target of this size can not meet the industrial needs.

Sputtering is one of the main technologies for preparing thin film materials. Atomics emitted by high-speed moving ions bombarding the target accumulate on the surface of the substrate to form a coating. The bombarded solid is the raw material for deposition of thin film by sputtering, which is called sputtering target.