Laser Electroplating of Nickel Phosphorus Tungsten Carbide

laser electroplating of nickel phosphorus tungsten carbide image

Tungsten carbide particles have a series of advantages, such as chemical stability, high hardness, almost comparable to the hardness of diamond, and extremely high wear resistance. The bonding strength between deposited tungsten carbide particles and Ni-P coatings will affect the performance of the composite coatings. Therefore, improving the bonding strength between coating and matrix and the bonding between deposited tungsten carbide particles and nickel phosphorus cells and avoiding the falling off of deposited particles become the key to ensure the effectiveness of composite coating.

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How to Improve the Particle Size of Tungsten Powder

how to improve the particle size of tungsten powder image

Tungsten powder is widely used in cemented carbide, tungsten products, chemical industry and steel industry. Tungsten powder is used as raw material for cemented carbide products and other tungsten products. Its particle size and size distribution have an important impact on product performance.

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Tungsten Copper Board File

tungsten copper plate picture

Tungsten copper board file is a file fitter filing of tool steel, steel file sub-flat, round, square, angular, five and a half, flat to flat file also challenge the filing, circle is round file, square is square file, triangular file angle, half semicircle filing, the board filing can also be called flat file.

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Reverse Thinking to Obtain Gypsum from Scheelite Slag

getting gypsum from scheelite waste image

Because tungsten can form soluble heteropoly acid (such as [PW12O40]3-) with impurities such as phosphorus, arsenic and silicon at the ratio of 1:6 to 1:12, a small amount of phosphorus can cause a large amount of tungsten dispersion and loss in the process of hydrochloric acid decomposition, so hydrochloric acid decomposition process mainly deals with high-grade Scheelite Concentrate (requiring low impurities such as phosphorus and arsenic).

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Tungsten Copper Support Plate

tungsten copper plate picture

Tungsten copper support plate means it is used as a key foundation dedicated integrated circuit card module encapsulation material, primarily protects the chip and the role of integrated circuit chips and external interface as in the form of the strip, the surface will be gold-plated gold yellow.

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