Annealing Process Effect on Tungsten Copper Electrode Properties II

Some experiments shows that annealing process has a great influence on the electrical conductivity of tungsten copper electrode, there is a table of the electrical conductivity of W-25Cu tungsten copper electrode at different temperature in the part one.

The table shows that when the annealing temperature reaches 800 ℃, the electrical conductivity of tungsten copper electrode is the highest, after which the temperature continues to rise, the conductivity decreased. Theoretically, this is due to the elimination of internal stress and the Cu phase recrystallization.

On the one hand, when tungsten skeleton is starting cooling process after infiltrated at high temperature, it produce large internal stress because of the a great difference between the coefficient of thermal expansion of tungsten (W) and copper (Cu), which affects the electrical conductivity of tungsten copper electrodes. On the other hand, copper phase recrystallized at 400 ℃, and when the temperature rises to 800 ℃, copper atom lattice distortion reduced, the crystal defects supplemented and improved conduction mechanism of Cu is further reflected. However, with further increase of annealing temperature, changes in Cu phase grain boundaries will gradually slow, the impact on the conductivity becomes negligible.

More infomation about annealing process effect on tungsten copper electrode properties, click here:

http://news.chinatungsten.com/en/tungsten-information/80963-ti-10443

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