Because tungsten can form soluble heteropoly acid (such as [PW₁₂O₄₀]₃^-) with impurities such as phosphorus, arsenic and silicon at the ratio of 1:6 to 1:12, a small amount of phosphorus can cause a large amount of tungsten dispersion and loss in the process of hydrochloric acid decomposition, so hydrochloric acid decomposition process mainly deals with high-grade Scheelite Concentrate (requiring low impurities such as phosphorus and arsenic).

Tungsten copper support plate means it is used as a key foundation dedicated integrated circuit card module encapsulation material, primarily protects the chip and the role of integrated circuit chips and external interface as in the form of the strip, the surface will be gold-plated gold yellow.

Tungsten copper board file is a file fitter filing of tool steel, steel file sub-flat, round, square, angular, five and a half, flat to flat file also challenge the filing, circle is round file, square is square file, triangular file angle, half semicircle filing, the board filing can also be called flat file.

Tungsten copper labtech combines the advantages of tungsten and copper, because of its high thermal conductivity so that electric panels can heat rapidly. Compared to other metal materials, tungsten copper with superior thermal performance, long life, can greatly reduce costs.