W-Cu composite material is a high melting point , high conductivity and high density of tungsten and a low coefficient of expansion , high thermal conductivity copper composition , both the advantages of both can , having high thermal conductivity properties such as low expansion coefficient , good high temperature strength and arc erosion resistant properties. As early as in the 1930s , tungsten -copper composite material due to its good compressive strength and resistance to electrical ablation performance, high-voltage electrical switches and other industrial sectors has been widely applied . Into the sixties, tungsten -copper composite material gradually gained in the field of resistance welding electrodes , aerospace and high-temperature parts. Since then, with gradually improved preparation technology , electronic packaging and in the nineties as a heat sink material began in the field of LSI and high-power electronic devices such as access to a wide range of applications . Into the 21st century, tungsten -copper composite material is used as cover material HEAT medicine , materials and target missile nozzle caused concern in the military and high-tech fields .

Now , tungsten -copper composite material due to its good electrical conductivity , thermal conductivity and excellent thermal stability , has become a high-power microwave devices and ultra large scale integrated circuit substrates , embedded blocks , essential key material connections and cooling components , etc. its high thermal conductivity , high thermal stability and good formability near net sizes , can improve the use of power microelectronic devices , is conducive to miniaturization of devices and sophisticated development. Low thermal expansion coefficient and the thermal expansion coefficient of tungsten-copper composite material adjustability , enabling connection to match its semiconductor materials and microelectronic devices with silicon , gallium arsenide and other useful ceramic materials , to avoid thermal fatigue damage caused by thermal stress broaden the tungsten -copper composite material in the field of microelectronics applications.

Tungsten -copper composite material due to its high electrical conductivity, thermal conductivity, excellent arc resistance , anti-friction and thermal stability , have already obtained important applications in rail guns , rockets and missile nozzle throat rudder and other high-temperature gas fields . In recent years , tungsten -copper composite material is gradually being used as cover material HEAT drug , its high density , high sound speed and good mechanical properties , help to improve HEAT Sunder power. Europe and other developed countries, studies show that, compared with the pure copper HEAT drug cover , tungsten -copper composite material cover the drug in the triple bombing high caliber of conditions, the armor depth can be increased by 30 %. With the continuous development of high-performance tungsten-copper composite materials preparation technology and applied research , and applications in the military industry will be more broad.

Tungsten-copper composite powder metallurgy materials is an important one of the widely used method for preparing a " Infiltration law ." The method is a mixture of tungsten powder, tungsten powder and a small amount of copper powder or pressed into the blank , by the pre- firing temperature for preparing a porous tungsten skeleton, and then the molten metallic copper and a capillary force to flow along the gap gradually tungsten particles fill skeleton obtained tungsten -copper composite material. Preparation of material dissolved infiltration with high density, good sintering properties , electrical conductivity, thermal conductivity , etc. ideal .

Due to the large gap between the melting point of tungsten and copper and immiscible , were prepared by powder metallurgy method of tungsten-copper composite material is often not high density , usually resulting in a conductive material , inadequate thermal and mechanical properties. In order to continue to meet the new requirements proposed industrial development , preparation techniques tungsten-copper composite task facing major reforms . In recent years , highly dispersed , the rapid development of nano- powder preparation techniques , new pressing and sintering technology , the performance of tungsten-copper composite gained further improved, effective broaden its application in high-tech fields.


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