The present invention describes a tungsten / copper graded material. Characterized in that:
1) Material Design: both ends of the W / Cu graded materials are W and Cu alloys, the volume of distribution of the gradient layer W by the formula C = (x / d) p calculated, where: C is the volume of any gradient layer W percentage, x is the position of the layer corresponding to the gradient, d is the thickness of the graded layer, p is the composition distribution index, p values in the range of 0.6-1.8;
2) the thickness of the metal layer W 1-4mm, the thickness of the metal Cu 1-2mm;
3) layers of the intermediate layer is 1-8 layers; in order to improve the bonding strength between the W-Cu, 5-10 weight percent of added copper in the metal binder phase, these adhesives are Ni, Zr, V , Ti and Cr.