Application of Ultrasonic Treatment Technology on Tungsten Powder Copper Plating

Tungsten has excellent properties such as high melting point, high hardness and so on. Copper has good thermal conductivity and conductivity. The W-Cu composites, consisting of tungsten and copper, have good thermal conductivity and low thermal expansion coefficient. The traditional methods for the preparation of tungsten copper alloys include infiltration method, ionic thermal spraying and laminating powder metallurgy.

Infiltration is the most widely used technology and the most mature technology, but there are also some drawbacks. Because tungsten and copper are very different in nature. Tungsten and copper can only form pseudo alloy morphology, which is difficult to achieve uniform distribution of tungsten and copper, resulting in reduced or unstable performance.

With the research of new materials, especially the development of the electronic industry, the copper plating process has been deeply studied and widely used. In the electronics industry, tungsten copper is used as heat sink material because of its excellent thermal conductivity. It is widely used in large-scale integrated circuits, high-power microwave devices, various electronic device substrates, connectors, electronic packaging materials, heat sink and heat sink materials.

The study shows that the performance of tungsten powder affect the use of tungsten powder and the performance of its products, chemical copper plating on the surface of tungsten powder and then sintering, the processing properties, thermal conductivity and pressing performance of the tungsten copper alloy prepared by other methods can be obtained. Moreover, the copper plating on the tungsten powder can get more uniform alloy than the traditional process.

At present, relatively mature copper plating processes include sol-gel process and chemical plating. However, there are many problems such as slow plating speed, uneven coating, unfirm coating and dense coating. Therefore, it is very important to seek a high quality coating process. In recent years, some scholars have studied the surface coating process of ultrasonic tungsten powder.

The surface of the tungsten powder particles prepared by ultrasound is smooth and smooth, and the copper coating is continuous, uniform and compact. It shows that the plating method adopted in this method solves the problem of uneven and unfirm coating on the existing tungsten coated tungsten powder, improves the plating speed and the density of the coating, shortens the production cycle, and has wide application fields and market prospects.

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